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Prelaminated inlays Combi

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LUX-IDent’s prepressed inlays are designed specifically with the card manufacturer in mind.

Prelaminated inlays Combi consist of two or even more different chip technologies, offering combinations of HF + LF, HF + HF or LF + LF chips in one card. Even a contact chip module can be embedded if the layout is designed accordingly.

Design & Applications

Prelaminated inlays are suitable for use in the production of ISO standard cards. LUX-IDent uses a proprietary manufacturing process to produce its prelaminated inlays. Wire embedding and / or coil winding technologies are used depending on suitability.

Our inlays are very robust and boast unequaled torsion / bending characteristics, extreme durability and optimized read / write performance. The inlays have a completely flat finish and bring numerous benefits to card manufacturers.

Our prelaminated inlay is essentially a semi-finished product, so that the card manufacturer merely needs to collate his printed sheets with the inlay and laminate the “sandwich”.

Features

  • Very reliable and robust plastic package
  • High reading distance optimized to each chip
  • Materials: PVC, PETG, PC
  • Colour: white or transparent
  • Possibility of combining two and more different chip technologies in one prelaminated sheet
  • Different sheet formats are available 1 × 5, 2 × 5, 3 × 6, 3 × 7, 3 × 8, 3 × 10, 4 × 10 up to 640 × 520 mm, others upon request

Based on specific customer requests, our antenna design allows us to position an antenna on the sheet layout along the embedding of contact chip module without any interference from the RFID antenna. This is what we call the hybrid card, which combines contactless and contact chip technology into one card.

Examples of application

  • Physical access
  • Logical access
  • Public transport
  • City card
  • Student card
  • e-purse systems
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Available chip technologies

Manufacturer 125 kHz 13.56 MHz
EM Microelectronic EM4102, EM4200, EM4305, EM4450
NXP Hitag® 1, Hitag® 2, Hitag® S 256bit, Hitag® S 2048bit MIFARE Ultralight® C, MIFARE Ultralight® EV1, MIFARE® Classic 1K EV1, MIFARE® Classic 4K EV1, MIFARE® DESFire® 256B EV1, MIFARE® DESFire® 2K EV1/EV2, MIFARE® DESFire® 4K EV1/EV2, MIFARE® DESFire® 8K EV1/EV2, MIFARE® Plus® SE, MIFARE® Plus® S 2K, MIFARE® Plus® S 4K, MIFARE® Plus® X 2K, MIFARE® Plus® X 4K, MIFARE® Plus® EV1 2K, MIFARE® Plus® EV1 4K
I-Code® SLIX
NTAG213, NTAG215, NTAG216
SmartMX (JCOP)
Infineon MIFARE® NRG SLE66R35 1K
Microchip – Atmel ATA5575M1, ATA5575M2, ATA5577, Q5
Legic® Prime: MIM256, MIM1024
Advant: ATC256-MV410, ATC1024-MV110, ATC1024-MV010, ATC4096-MP311
CTC 4096-MP410, CTC 4096-MM410

Other ICs are available upon request.

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