HF & NFC Inlay 32 × 15 mm
13.56 MHz RFID Transponder Inlay Al

The inlays are ready for converting into various types of smart labels / tickets / tags as typically used for RFID applications in:

The chip position in MD direction can vary depending on the inlay tuning frequency and chip size (type).

NXP
Manufacturer Standard	Chip type
ISO 15693 ISO 18000 3M3	ICODE® family
ISO 14443A	MIFARE Classic®, MIFARE Ultralight®, MIFARE Plus®, MIFARE® DESFire®, NTAG™ family
NFC	MIFARE Ultralight®, MIFARE Plus®, MIFARE® DESFire®, NTAG™ family
Infineon
ISO 15693	my-d™ vicinity
ISO 14443A	my-d™ proximity, my-d™ move, SLE77xxx (A/B), CIPURSE™ products
NFC	my-d™ NFC, my-d™ move NFC, CIPURSE™ products
STMicroelectronics
ISO 15693	ST25TVxxx family
ISO 14443A	ST25TAxxx family
NFC	ST25TAxxx family
EM Microelectronic
ISO 15693	EM4237 SLIC/SLIX
NFC	EM4423, NF4
Fujitsu
ISO 15693	MB89R‑family

Other ICs are available upon request.

Operation temperature	−25°C to 70°C/85°C, depending on chip specification
Storage conditions	1 year at 10°C to 25°C, maximum 60% relative humidity
Thermal humidity test	168h at 85°C / 85% humidity
Temperature cycle resistance	250 cycles at −40°C to 85°C
Bending	Chip upside: ∅ 30mm 15N 35 mm (CD) 30N 48 mm (CD) Chip downside: ∅ 40mm 15N 35 mm (CD) 30N 48 mm (CD)
Shear force onto chip	10N / mm² chip area
ESD voltage immunity	±2kV max. peak – human body model (HBM) accord. to chip specification

Quantity on reel	5,000 / 10,000
Reel dimension	∅ Reel: 265 mm / 365 mm ∅ Core: 76.2 mm (3”)
QC inspection inline	100% electrical UID test with bad marking of rejected inlays

L15-032015A11-xxx (17pF)
L15-032015B11-xxx (23.5pF)
L15-032015C11-xxx (50pF)
L15-032015D11-xxx (70pF)