HF & NFC and UHF Labels
Design & Applications
Our high-quality, high-performance inlays are the core component used before converting into various types of self‑adhesive smart labels. Available in any frequency, size or shape, the labels range from simple, blank varieties to complex, personalized ones. Count on LUX-IDent to provide the optimum smart label solution for your RFID application.
Typical applications
- Object identification and authentication
- Production and process management
- Logistics, supply chain management
- Maintenance, facility management
- Brand protection
- Real-time location tracking
Special features
- Printing with different printing technologies
- Serialization, UID printing
- Coding and numbering
- On-metal (HF)
- Temper-proof (mechanical, electrical)
- Doming
Customized label solutions
Label characteristics vary widely depending on the conditions of use in the application and on many other factors. LUX-IDent can develop customer- and application-specific label solutions to meet specific requirements. We are committed to providing label solutions that combine the highest technical performance with economic feasibility.
RFID chip types
| Manufacturer Standard |
Chip type |
| NXP | |
|---|---|
| ISO 15693 ISO 18000 3M3 |
ICODE® family |
| ISO 14443A | MIFARE Classic®, MIFARE Ultralight®, MIFARE Plus®, MIFARE® DESFire®, NTAG™ family |
| NFC | MIFARE Ultralight®, MIFARE Plus®, MIFARE® DESFire®, NTAG™ family |
| Infineon | |
| ISO 15693 | my-d™ vicinity |
| ISO 14443A | my-d™ proximity, my-d™ move, SLE77xxx (A/B), CIPURSE™ products |
| NFC | my-d™ NFC, my-d™ move NFC, CIPURSE™ products |
| STMicroelectronics | |
| ISO 15693 | ST25TV64K |
| ISO 14443A | ST25TAxxx family |
| ISO 14443B | ST25TBxxx family (on request) |
| NFC | ST25TAxxx family |
| EM Microelectronic | |
| ISO 15693 | EM4237 SLIC/SLIX |
| NFC | EM4423, NF4 |
| Fujitsu | |
| ISO 15693 | MB89R‑family |
Other ICs and UHF ICs are available upon request.
Reliability
| Operation temperature | −25°C to 70°C/85°C, depending on chip specification |
|---|---|
| Storage conditions | 1 year at 10°C to 25°C, maximum 60% relative humidity |
| Thermal humidity test | 168h at 85°C / 85% humidity |
| Temperature cycle resistance | 250 cycles at −40°C to 85°C |
| Bending |
Chip upside: ∅ 30mm
Chip downside: ∅ 40mm
|
| Shear force onto chip | 10N / mm² chip area |
| ESD voltage immunity | ±2kV max. peak – human body model (HBM) accord. to chip specification |
Inlay delivery details
| Quantity on reel | 5,000 / 10,000 |
|---|---|
| Reel dimension | ∅ Reel: 265 mm / 365 mm ∅ Core: 76.2 mm (3”) |
| QC inspection inline | 100% electrical UID test with bad marking of rejected inlays |
Coming soon
- Sensor labels able to track temperature, humidity or pressure, among others
- IoT labels supporting industry 4.0 adoption, for smart homes and cities
