logo_NFC_blueHF & NFC and UHF Labels


LUX-IDent provides thin and flexible label solutions for a wide range of RFID applications.

See further available RFID tags offered by HID Global.

Design & Applications

Our high-quality, high-performance inlays are the core component used before converting into various types of self‑adhesive smart labels. Available in any frequency, size or shape, the labels range from simple, blank varieties to complex, personalized ones. Count on LUX-IDent to provide the optimum smart label solution for your RFID application.

Typical applications

  • Object identification and authentication
  • Production and process management
  • Logistics, supply chain management
  • Maintenance, facility management
  • Brand protection
  • Real-time location tracking

Special features

  • Printing with different printing technologies
  • Serialization, UID printing
  • Coding and numbering
  • On-metal (HF)
  • Temper-proof (mechanical, electrical)
  • Doming

Customized label solutions

Label characteristics vary widely depending on the conditions of use in the application and on many other factors. LUX-IDent can develop customer- and application-specific label solutions to meet specific requirements. We are committed to providing label solutions that combine the highest technical performance with economic feasibility.


RFID chip types

Chip type
ISO 15693
ISO 18000 3M3
ICODE® family
ISO 14443A MIFARE Classic®, MIFARE Ultralight®, MIFARE Plus®, MIFARE® DESFire®, NTAG™ family
NFC MIFARE Ultralight®, MIFARE Plus®, MIFARE® DESFire®, NTAG™ family
ISO 15693 my-d™ vicinity
ISO 14443A my-d™ proximity, my-d™ move, SLE77xxx (A/B), CIPURSE™ products
NFC my-d™ NFC, my-d™ move NFC, CIPURSE™ products
ISO 15693 ST25TV64K
ISO 14443A ST25TAxxx family
ISO 14443B ST25TBxxx family (on request)
NFC ST25TAxxx family
EM Microelectronic
ISO 15693 EM4237 SLIC/SLIX
NFC EM4423, NF4
ISO 15693 MB89R‑family

Other ICs and UHF ICs are available upon request.


Operation temperature −25°C to 70°C/85°C, depending on chip specification
Storage conditions 1 year at 10°C to 25°C, maximum 60% relative humidity
Thermal humidity test 168h at 85°C / 85% humidity
Temperature cycle resistance 250 cycles at −40°C to 85°C

Chip upside: ∅ 30mm

  • 15N 35 mm (CD)
  • 30N 48 mm (CD)

Chip downside: ∅ 40mm

  • 15N 35 mm (CD)
  • 30N 48 mm (CD)
Shear force onto chip 10N / mm² chip area
ESD voltage immunity ±2kV max. peak – human body model (HBM) accord. to chip specification

Inlay delivery details

Quantity on reel 5,000 / 10,000
Reel dimension ∅ Reel: 265 mm / 365 mm
∅ Core: 76.2 mm (3”)
QC inspection inline 100% electrical UID test with bad marking of rejected inlays

Coming soon

  • Sensor labels able to track temperature, humidity or pressure, among others
  • IoT labels supporting industry 4.0 adoption, for smart homes and cities


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