HF & NFC Inlay 
Design & Applications
The inlays are ready for converting into various types of smart labels / tickets / tags as typically used for RFID applications in:
- Logistics
- Asset management
- Supply chain management
- Transportation
- Identification and authentication
- NFC
Inlay overview with dimensions – in reel format (mm)
The chip position in MD direction can vary depending on the inlay tuning frequency and chip size (type).
Cross section
RFID chip types
| Manufacturer Standard |
Chip type |
| NXP | |
|---|---|
| ISO 15693 ISO 18000 3M3 |
ICODE® family |
| ISO 14443A | MIFARE Ultralight®, MIFARE Plus®, MIFARE® DESFire®, NTAG™ family |
| NFC | MIFARE Classic® EV1, MIFARE Ultralight®, MIFARE Plus®, MIFARE® DESFire®, NTAG™ family |
| Infineon | |
| ISO 15693 | my-d™ vicinity |
| ISO 14443A | my-d™ proximity, my-d™ move, SLE77xxx (A/B), CIPURSE™ move |
| NFC | my-d™ NFC, my-d™ move NFC, CIPURSE™ move |
| STMicroelectronics | |
| ISO 15693 | ST25TVxxx family |
| ISO 14443A | ST25TAxxx family |
| NFC | ST25TAxxx family |
| EM Microelectronic | |
| ISO 15693 | EM4237 SLIC/SLIX |
| NFC | EM4423(HF) |
| Fujitsu | |
| ISO 15693 | MB89R‑family |
Other ICs are available upon request.
Reliability
| Operation temperature | −25°C to 70°C/85°C, depending on chip specification |
|---|---|
| Storage conditions | 1 year at 10°C to 25°C, maximum 60% relative humidity |
| Thermal humidity test | 168h at 85°C / 85% humidity |
| Temperature cycle resistance | 250 cycles at −40°C to 85°C |
| Bending |
Chip upside: ∅ 30mm
Chip downside: ∅ 40mm
|
| Shear force onto chip | 10N / mm² chip area |
| ESD voltage immunity | ±2kV max. peak – human body model (HBM) accord. to chip specification |
Inlay delivery details
| Quantity on reel | 5,000 / 10,000 |
|---|---|
| Reel dimension | ∅ Reel: 265 mm / 365 mm ∅ Core: 76.2 mm (3”) |
| QC inspection inline | 100% electrical UID test with bad marking of rejected inlays |
Product codes
L15-D012A11-xxx (17pF)
L15-D012B11-xxx (23.5pF)
L15-D012C11-xxx (50pF)
L15-D012D11-xxx (70pF)
